| Name: | LA Semiconductor LLC |
| Jurisdiction: | Idaho |
| Legal type: | Foreign Limited Liability Company |
| Status: | Active-Existing |
| Date of registration: | 28 Sep 2022 (3 years ago) |
| Financial Date End: | 30 Sep 2025 |
| Entity Number: | 4926811 |
| Place of Formation: | OHIO |
| File Number: | 843037 |
| ZIP code: | 83201 |
| County: | Bannock County |
| Principal Address: | 2300 W BUCKSKIN RD POCATELLO, ID 83201 |
| Mailing Address: | MIKE WARD 2300 W BUCKSKIN RD POCATELLO, ID 83201-2734 |
| Plan Name | Plan Year | EIN/PN | Received | Sponsor | Total number of participants | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LA SEMI 401(K) PLAN | 2022 | 881145409 | 2023-10-03 | LA SEMICONDUCTOR | 0 | |||||||||||
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| Name | Role | Address |
|---|---|---|
| Mike Ward | Agent | 2300 W BUCKSKIN RD, POCATELLO, ID 83201-2734 |
| Name | Role | Address | Appointed On |
|---|---|---|---|
| Mike Ward | Member | 2300 W BUCKSKIN ROAD, POCATELLO, ID 83201 | 2023-12-15 |
| Filing Name | Filing Number | Filing date |
|---|---|---|
| Annual Report | 0005901428 | 2024-09-16 |
| Annual Report | 0005512738 | 2023-12-15 |
| Initial Filing | 0004926811 | 2022-09-28 |
| Status | User ID | Name of Firm | Trade Name | UEI | Address | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Active | P2966932 | LA SEMICONDUCTOR LLC | - | Q29UEJSMM274 | 2300 W BUCKSKIN RD, POCATELLO, ID, 83201-2734 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| HUBZone Certified | No |
| Women Owned Certified | No |
| Women Owned Pending | No |
| Economically Disadvantaged Women Owned Certified | No |
| Economically Disadvantaged Women Owned Pending | No |
| Veteran-Owned Small Business Certified | No |
| Veteran-Owned Small Business Joint Venture | No |
| Service-Disabled Veteran-Owned Small Business Certified | No |
| Service-Disabled Veteran-Owned Small Business Joint Venture | No |
Bonding Levels
| Description | Construction Bonding Level (per contract) |
| Level | (none given) |
| Description | Construction Bonding Level (aggregate) |
| Level | (none given) |
| Description | Service Bonding Level (per contract) |
| Level | (none given) |
| Description | Service Bonding Level (aggregate) |
| Level | (none given) |
NAICS Codes with Size Determinations by NAICS
| Primary | Yes |
| Code | 334413 |
| NAICS Code's Description | Semiconductor and Related Device Manufacturing |
| Buy Green | Yes |
Export Profile (Trade Mission Online)
| Exporter | Firm hasn't answered this question yet |
| Export Business Activities | (none given) |
| Exporting to | (none given) |
| Desired Export Business Relationships | (none given) |
| Description of Export Objective(s) | (none given) |
Date of last update: 25 Mar 2025
Sources: Idaho Secretary of State
