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  5. AMERICAN SEMICONDUCTOR, INC.

AMERICAN SEMICONDUCTOR, INC.

Company Details

Name: AMERICAN SEMICONDUCTOR, INC.
Jurisdiction: Idaho
Legal type: General Business Corporation (D)
Status: Active-Good Standing
Date of registration: 13 Nov 2001 (23 years ago)
Financial Date End: 30 Nov 2025
Entity Number: 430884
Place of Formation: IDAHO
File Number: 430884
ZIP code: 83709
County: Ada County
Mailing Address: LORELLI HACKLER 6987 W TARGEE ST BOISE, ID 83709-3209

Unique Entity ID

Unique Entity ID Expiration Date Physical Address Mailing Address
C1BNR9HJBQK8 2025-01-03 6987 W TARGEE ST, BOISE, ID, 83709, 3209, USA 6987 W TARGEE ST, BOISE, ID, 83709, USA

Business Information
URL http://www.americansemi.com
Congressional District 02
State/Country of Incorporation ID, USA
Activation Date 2024-01-08
Initial Registration Date 2001-12-11
Entity Start Date 2001-11-13
Fiscal Year End Close Date Sep 30

Service Classifications
NAICS Codes 334412, 334413, 541330, 541715

Points of Contacts
Electronic Business
Title PRIMARY POC
Name DOUGLAS R HACKLER
Role PRESIDENT & CEO
Address AMERICAN SEMICONDUCTOR, INC., 6987 W. TARGEE STREET, BOISE, ID, 83709, USA
Title ALTERNATE POC
Name LORELLI D HACKLER
Role CFO
Address AMERICAN SEMICONDUCTOR, INC., 6987 W. TARGEE STREET, BOISE, ID, 83709, USA
Government Business
Title PRIMARY POC
Name LORELLI D HACKLER
Role CFO
Address AMERICAN SEMICONDUCTOR, INC., 6987 W. TARGEE STREET, BOISE, ID, 83709, USA
Title ALTERNATE POC
Name DOUGLAS R HACKLER
Role PRESIDENT & CEO
Address AMERICAN SEMICONDUCTOR, INC., 6987 W. TARGEE STREET, BOISE, ID, 83709, USA
Past Performance
Title PRIMARY POC
Name LORELLI D HACKLER
Role CFO
Address AMERICAN SEMICONDUCTOR, INC., 6987 W. TARGEE STREET, BOISE, ID, 83709, USA
Title ALTERNATE POC
Name DOUGLAS R HACKLER
Role PRESIDENT & CEO
Address AMERICAN SEMICONDUCTOR, INC., 6987 W. TARGEE STREET, BOISE, ID, 83709, USA

Central Index Key

CIK number Mailing Address Business Address Phone
1686401 6987 W. TARGEE STREET, BOISE, ID, 83709 6987 W. TARGEE STREET, BOISE, ID, 83709 208-336-2773

Filings since 2018-11-28
Form type D/A
File number 021-271921
Filing date 2018-11-28
File View File

Filings since 2018-10-10
Form type D/A
File number 021-271921
Filing date 2018-10-10
File View File

Filings since 2017-10-16
Form type D/A
File number 021-271921
Filing date 2017-10-16
File View File

Filings since 2016-10-06
Form type D
File number 021-271921
Filing date 2016-10-06
File View File

form 5500

Plan Name Plan Year EIN/PN Received Sponsor Total number of participants
AMERICAN SEMICONDUCTOR 401(K) PLAN 2023 820537154 2024-07-09 AMERICAN SEMICONDUCTOR, INC. 15
File View Page
Three-digit plan number (PN) 001
Effective date of plan 2008-06-01
Business code 334410
Sponsor’s telephone number 2083362773
Plan sponsor’s address 6987 W TARGEE ST, BOISE, ID, 837090000

Signature of
Role Plan administrator
Date 2024-07-09
Name of individual signing LORELLI HACKLER
Valid signature Filed with authorized/valid electronic signature
AMERICAN SEMICONDUCTOR 401(K) PLAN 2022 820537154 2023-07-18 AMERICAN SEMICONDUCTOR, INC. 15
File View Page
Three-digit plan number (PN) 001
Effective date of plan 2008-06-01
Business code 334410
Sponsor’s telephone number 2083362773
Plan sponsor’s address 6987 W TARGEE ST, BOISE, ID, 837090000

Signature of
Role Plan administrator
Date 2023-07-18
Name of individual signing LORELLI HACKLER
Valid signature Filed with authorized/valid electronic signature
AMERICAN SEMICONDUCTOR 401(K) PLAN 2021 820537154 2022-09-23 AMERICAN SEMICONDUCTOR, INC. 18
File View Page
Three-digit plan number (PN) 001
Effective date of plan 2008-06-01
Business code 334410
Sponsor’s telephone number 2083362773
Plan sponsor’s address 6987 W TARGEE ST, BOISE, ID, 837090000

Signature of
Role Plan administrator
Date 2022-09-23
Name of individual signing LORELLI HACKLER
Valid signature Filed with authorized/valid electronic signature
AMERICAN SEMICONDUCTOR 401(K) PLAN 2020 820537154 2021-07-30 AMERICAN SEMICONDUCTOR, INC. 18
File View Page
Three-digit plan number (PN) 001
Effective date of plan 2008-06-01
Business code 334410
Sponsor’s telephone number 2083362773
Plan sponsor’s address 6987 W TARGEE ST, BOISE, ID, 837090000

Signature of
Role Plan administrator
Date 2021-07-30
Name of individual signing LORELLI HACKLER
Valid signature Filed with authorized/valid electronic signature
AMERICAN SEMICONDUCTOR 401(K) PLAN 2019 820537154 2020-07-16 AMERICAN SEMICONDUCTOR, INC. 15
File View Page
Three-digit plan number (PN) 001
Effective date of plan 2008-06-01
Business code 334410
Sponsor’s telephone number 2083362773
Plan sponsor’s address 6987 W TARGEE ST, BOISE, ID, 837090000

Signature of
Role Plan administrator
Date 2020-07-16
Name of individual signing LORELLI HACKLER
Valid signature Filed with authorized/valid electronic signature
AMERICAN SEMICONDUCTOR 401(K) PLAN 2018 820537154 2019-07-18 AMERICAN SEMICONDUCTOR, INC. 16
File View Page
Three-digit plan number (PN) 001
Effective date of plan 2008-06-01
Business code 334410
Sponsor’s telephone number 2083362773
Plan sponsor’s address 6987 W TARGEE ST, BOISE, ID, 83709

Signature of
Role Plan administrator
Date 2019-07-18
Name of individual signing LORELLI HACKLER
Valid signature Filed with authorized/valid electronic signature
AMERICAN SEMICONDUCTOR 401(K) PLAN 2017 820537154 2018-07-28 AMERICAN SEMICONDUCTOR, INC. 15
File View Page
Three-digit plan number (PN) 001
Effective date of plan 2008-06-01
Business code 334410
Sponsor’s telephone number 2083362773
Plan sponsor’s address 6987 W TARGEE ST, BOISE, ID, 83709

Signature of
Role Plan administrator
Date 2018-07-28
Name of individual signing LORELLI HACKLER
Valid signature Filed with authorized/valid electronic signature
AMERICAN SEMICONDUCTOR 401(K) PLAN 2016 820537154 2017-07-10 AMERICAN SEMICONDUCTOR, INC. 16
File View Page
Three-digit plan number (PN) 001
Effective date of plan 2008-06-01
Business code 334410
Sponsor’s telephone number 2083362773
Plan sponsor’s address 6987 W TARGEE ST, BOISE, ID, 83709

Signature of
Role Plan administrator
Date 2017-07-10
Name of individual signing LARRY CROCKETT
Valid signature Filed with authorized/valid electronic signature
AMERICAN SEMICONDUCTOR 401(K) PLAN 2015 820537154 2016-07-12 AMERICAN SEMICONDUCTOR, INC. 16
File View Page
Three-digit plan number (PN) 001
Effective date of plan 2008-06-01
Business code 334410
Sponsor’s telephone number 2083362773
Plan sponsor’s address 6987 W. TARGEE ST., BOISE, ID, 83709

Signature of
Role Plan administrator
Date 2016-07-12
Name of individual signing LARRY CROCKETT
Valid signature Filed with authorized/valid electronic signature
AMERICAN SEMICONDUCTOR 401(K) PLAN 2014 820537154 2015-07-14 AMERICAN SEMICONDUCTOR, INC. 15
File View Page
Three-digit plan number (PN) 001
Effective date of plan 2008-06-01
Business code 334410
Sponsor’s telephone number 2083362773
Plan sponsor’s address P.O. BOX 16367, BOISE, ID, 837156367

Signature of
Role Plan administrator
Date 2015-07-14
Name of individual signing LARRY CROCKETT
Valid signature Filed with authorized/valid electronic signature

Agent

Name Role Address
DOUGLAS R HACKLER Agent 6987 W TARGEE STREET, BOISE, ID 83709

Secretary

Name Role Address Appointed On
Lorelli D Hackler Secretary 6987 W TARGEE STREET, BOISE, ID 83709 2020-12-03

Treasurer

Name Role Address Appointed On Resigned On
Lorelli D Hackler Treasurer 6987 W TARGEE STREET, BOISE, ID 83709 2023-12-12 2023-12-12

Director

Name Role Address Appointed On Resigned On
Kelly A Fuller Director 10400 OVERLAND ROAD, BOISE, ID 83709 2023-12-12 2023-12-12
Tim Haney Director 7253 N MOON DRUMMER WAY, MERIDIAN, ID 83646 2023-12-12 2023-12-12

President

Name Role Address Appointed On Resigned On
Douglas R Hackler President 6987 W TARGEE STREET, BOISE, ID 83709 2023-12-12 2023-12-12

Filing

Filing Name Filing Number Filing date
Annual Report 0006018362 2024-12-09
Annual Report 0005508675 2023-12-12
Annual Report 0004990139 2022-11-10
Annual Report 0004436094 2021-10-04
Annual Report 0004083871 2020-12-03
Annual Report 0003660772 2019-11-01
Annual Report 0003660869 2019-11-01
Annual Report 0003348950 2018-11-15
Annual Report 0002833937 2017-10-27
Annual Report 0002833935 2016-11-18

USAspending Awards. Contracts

Contract Type Award or IDV Flag PIID Start Date Current End Date Potential End Date
PURCHASE ORDER AWARD FA865012M3219 2012-04-20 2013-01-21 2013-01-21
Unique Award Key CONT_AWD_FA865012M3219_9700_-NONE-_-NONE-
Awarding Agency Department of Defense
Link View Page

Award Amounts
Obligated Amount 149990.00
Current Award Amount 149990.00
Potential Award Amount 149990.00

Description
Title STRUCTURALLY COMPLIANT RF ELECTRONICS-SBIR I
NAICS Code 541712: RESEARCH AND DEVELOPMENT IN THE PHYSICAL, ENGINEERING, AND LIFE SCIENCES (EXCEPT BIOTECHNOLOGY)
Product and Service Codes AC11: R&D- DEFENSE SYSTEM: AIRCRAFT (BASIC RESEARCH)

Recipient Details
Recipient AMERICAN SEMICONDUCTOR, INC
UEI C1BNR9HJBQK8
Legacy DUNS 076338677
Recipient Address 3100 S VISTA AVE STE 230, BOISE, ADA, IDAHO, 837057368, UNITED STATES
DEFINITIVE CONTRACT AWARD FA945311C0176 2011-09-30 2013-12-30 2013-12-30
Unique Award Key CONT_AWD_FA945311C0176_9700_-NONE-_-NONE-
Awarding Agency Department of Defense
Link View Page

Award Amounts
Obligated Amount 749365.00
Current Award Amount 749365.00
Potential Award Amount 749365.00

Description
Title HIGH PERFORMANCE, ULTRA POWER SPA-1 ASIC FOR SPACE PLUG-AND-PLAY AVIONICS
NAICS Code 541712: RESEARCH AND DEVELOPMENT IN THE PHYSICAL, ENGINEERING, AND LIFE SCIENCES (EXCEPT BIOTECHNOLOGY)
Product and Service Codes AC22: R&D-MISSILE & SPACE SYS-A RES/EXPL

Recipient Details
Recipient AMERICAN SEMICONDUCTOR, INC
UEI C1BNR9HJBQK8
Legacy DUNS 076338677
Recipient Address 3100 S VISTA AVE STE 230, BOISE, ADA, IDAHO, 837057368, UNITED STATES
DEFINITIVE CONTRACT AWARD HQ014711C7512 2011-06-24 2012-02-29 2012-02-29
Unique Award Key CONT_AWD_HQ014711C7512_9700_-NONE-_-NONE-
Awarding Agency Department of Defense
Link View Page

Award Amounts
Obligated Amount 99963.00
Current Award Amount 99963.00
Potential Award Amount 149961.00

Description
Title PH I RESEARCH&DEVELOPMENT
NAICS Code 541712: RESEARCH AND DEVELOPMENT IN THE PHYSICAL, ENGINEERING, AND LIFE SCIENCES (EXCEPT BIOTECHNOLOGY)
Product and Service Codes AC21: R&D-MISSILE & SPACE SYS-B RES

Recipient Details
Recipient AMERICAN SEMICONDUCTOR, INC
UEI C1BNR9HJBQK8
Legacy DUNS 076338677
Recipient Address 3100 S VISTA AVE STE 230, BOISE, ADA, IDAHO, 837057368, UNITED STATES
DEFINITIVE CONTRACT AWARD FA945310C0315 2010-08-17 2012-02-23 2012-02-23
Unique Award Key CONT_AWD_FA945310C0315_9700_-NONE-_-NONE-
Awarding Agency Department of Defense
Link View Page

Award Amounts
Obligated Amount 3130411.00
Current Award Amount 3130411.00
Potential Award Amount 3130411.00

Description
Title DOMESTIC-ON-SHORE MANUFACTURING OF ELECTRONICS (DOME)
NAICS Code 541712: RESEARCH AND DEVELOPMENT IN THE PHYSICAL, ENGINEERING, AND LIFE SCIENCES (EXCEPT BIOTECHNOLOGY)
Product and Service Codes AC22: R&D-MISSILE & SPACE SYS-A RES/EXPL

Recipient Details
Recipient AMERICAN SEMICONDUCTOR, INC
UEI C1BNR9HJBQK8
Legacy DUNS 076338677
Recipient Address 3100 S VISTA AVE STE 230, BOISE, ADA, IDAHO, 837057368, UNITED STATES
PURCHASE ORDER AWARD FA945310M0151 2010-03-12 2011-03-11 2011-03-11
Unique Award Key CONT_AWD_FA945310M0151_9700_-NONE-_-NONE-
Awarding Agency Department of Defense
Link View Page

Award Amounts
Obligated Amount 99869.00
Current Award Amount 99869.00
Potential Award Amount 99869.00

Description
Title ULTRA LOW POWER HIGH PERFORMANCE MICROPROCESSOR CORE FOR MILITARY & SPACE APPLICATIONS
NAICS Code 541712: RESEARCH AND DEVELOPMENT IN THE PHYSICAL, ENGINEERING, AND LIFE SCIENCES (EXCEPT BIOTECHNOLOGY)
Product and Service Codes AC21: R&D-MISSILE & SPACE SYS-B RES

Recipient Details
Recipient AMERICAN SEMICONDUCTOR, INC
UEI C1BNR9HJBQK8
Legacy DUNS 076338677
Recipient Address 3100 S VISTA AVE STE 230, BOISE, ADA, IDAHO, 837057368, UNITED STATES
DEFINITIVE CONTRACT AWARD FA945309C0381 2009-08-28 2010-11-29 2010-11-29
Unique Award Key CONT_AWD_FA945309C0381_9700_-NONE-_-NONE-
Awarding Agency Department of Defense
Link View Page

Award Amounts
Obligated Amount 2909942.00
Current Award Amount 2909942.00
Potential Award Amount 2909942.00

Description
Title FLEXFET ULP CMOS CIRCUITS FOR SPACE ELECTRONICS
NAICS Code 541712: RESEARCH AND DEVELOPMENT IN THE PHYSICAL, ENGINEERING, AND LIFE SCIENCES (EXCEPT BIOTECHNOLOGY)
Product and Service Codes AC23: R&D-MISSILE & SPACE SYS-ADV DEV

Recipient Details
Recipient AMERICAN SEMICONDUCTOR, INC
UEI C1BNR9HJBQK8
Legacy DUNS 076338677
Recipient Address 3100 S VISTA AVE STE 230, BOISE, ADA, IDAHO, 837057368, UNITED STATES
DCA AWARD HQ000609C7134 2009-08-12 2009-09-27 2009-09-27
Unique Award Key CONT_AWD_HQ000609C7134_9700_-NONE-_-NONE-
Awarding Agency Department of Defense
Link View Page

Description
Title CONTRACT SUMMARY REPORT.
NAICS Code 541712: RESEARCH AND DEVELOPMENT IN THE PHYSICAL, ENGINEERING, AND LIFE SCIENCES (EXCEPT BIOTECHNOLOGY)
Product and Service Codes AC21: R&D-MISSILE & SPACE SYS-B RES

Recipient Details
Recipient AMERICAN SEMICONDUCTOR, INC
UEI C1BNR9HJBQK8
Legacy DUNS 076338677
Recipient Address 3100 S VISTA AVE STE 230, BOISE, 837057368, UNITED STATES
DCA AWARD FA945306C0043 2008-07-23 2009-05-17 2009-05-17
Unique Award Key CONT_AWD_FA945306C0043_9700_-NONE-_-NONE-
Awarding Agency Department of Defense
Link View Page

Description
Title NO COST TIME EXTENSION
NAICS Code 334413: SEMICONDUCTOR AND RELATED DEVICE MANUFACTURING
Product and Service Codes AC25: R&D-MISSILE & SPACE SYS-OPSY DEV

Recipient Details
Recipient AMERICAN SEMICONDUCTOR, INC
UEI C1BNR9HJBQK8
Legacy DUNS 076338677
Recipient Address 3100 S VISTA AVE STE 230, BOISE, 83705, UNITED STATES
DCA AWARD NNG06CA10C 2007-12-11 2008-03-28 2008-03-28
Unique Award Key CONT_AWD_NNG06CA10C_8000_-NONE-_-NONE-
Awarding Agency National Aeronautics and Space Administration
Link View Page

Description
Title SBIR PHASE 11 AWARD
NAICS Code 541710
Product and Service Codes AR21: R&D-SPACE SCIENCE & APPL-B RES

Recipient Details
Recipient AMERICAN SEMICONDUCTOR, INC
UEI C1BNR9HJBQK8
Legacy DUNS 076338677
Recipient Address 3100 S VISTA AVE STE 230, BOISE, 837055736, UNITED STATES

USAspending Awards. Financial Assistance

FAIN Awarding Agency Assistance Listings Start Date End Date Description
DESC0004479 Department of Energy 81.049 - OFFICE OF SCIENCE FINANCIAL ASSISTANCE PROGRAM 2010-06-26 2013-08-14 TAS::89 0222::TAS NEW PHASE I 2010 SBIR; TITLE: NEXT-GENERATION DETECTOR AND IMAGER DEVELOPMENT; PI: RICHARD HAYHURST
Recipient AMERICAN SEMICONDUCTOR, INC
Recipient Name Raw AMERICAN SEMICONDUCTOR INC
Recipient UEI C1BNR9HJBQK8
Recipient DUNS 076338677
Recipient Address 3100 S VISTA AVE STE 230, BOISE (COUNTY), BOISE, IDAHO, 83705-7368
Obligated Amount 1699557.00
Non-Federal Funding 0.00
Original Subsidy Cost 0.00
Face Value of Direct Loan 0.00
Link View Page
3422505003 Small Business Administration 59.012 - 7(A) LOAN GUARANTEES No data No data TO AID SMALL BUSINESSES WHICH ARE UNABLE TO OBTAIN FINANCING IN THE PRIVATE CREDIT MARKETPLACE
Recipient AMERICAN SEMICONDUCTOR, INC.
Recipient Name Raw AMERICAN SEMICONDUCTOR, INC.
Recipient Address 3100 S VISTA AVE STE 230, BOISE, ADA, IDAHO, 83705-0000, UNITED STATES
Obligated Amount 0.00
Non-Federal Funding 0.00
Original Subsidy Cost 7750.00
Face Value of Direct Loan 250000.00
Link View Page
FG02-08ER85163 Department of Energy 81.049 - OFFICE OF SCIENCE FINANCIAL ASSISTANCE PROGRAM 2008-07-22 2009-07-16 INTERNATIONAL LINEAR COLLIDER PIXEL ARRAY VERTEX DETECTOR DEVELOPMENT
Recipient AMERICAN SEMICONDUCTOR, INC
Recipient Name Raw AMERICAN SEMICONDUCTOR INC
Recipient UEI C1BNR9HJBQK8
Recipient DUNS 076338677
Recipient Address 3100 S VISTA AVE STE 230, 0, BOISE, ADA, IDAHO, 83705-7368
Obligated Amount 0.00
Non-Federal Funding 0.00
Original Subsidy Cost 0.00
Face Value of Direct Loan 0.00
Link View Page

Paycheck Protection Program

Loan Number Loan Funded Date SBA Origination Office Code Loan Delivery Method Borrower Street Address
4030778302 2021-01-22 1087 PPS 6987 W Targee St, Boise, ID, 83709-3209
Loan Status Date 2021-11-09
Loan Status Paid in Full
Loan Maturity in Months 60
SBA Guaranty Percentage 100
Loan Approval Amount (at origination) 243400
Loan Approval Amount (current) 243400
Undisbursed Amount 0
Franchise Name -
Lender Location ID 74899
Servicing Lender Name Washington Trust Bank
Servicing Lender Address 717 W Sprague Ave, SPOKANE, WA, 99201-3915
Rural or Urban Indicator U
Hubzone N
LMI N
Business Age Description Existing or more than 2 years old
Project Address Boise, ADA, ID, 83709-3209
Project Congressional District ID-02
Number of Employees 12
NAICS code 334413
Borrower Race Unanswered
Borrower Ethnicity Not Hispanic or Latino
Business Type Corporation
Originating Lender ID 74899
Originating Lender Name Washington Trust Bank
Originating Lender Address SPOKANE, WA
Gender Male Owned
Veteran Unanswered
Forgiveness Amount 245080.46
Forgiveness Paid Date 2021-10-08
7401897006 2020-04-07 1087 PPP 6987 W TARGEE ST, BOISE, ID, 83709-3209
Loan Status Date 2020-12-18
Loan Status Paid in Full
Loan Maturity in Months 24
SBA Guaranty Percentage 100
Loan Approval Amount (at origination) 230000
Loan Approval Amount (current) 230000
Undisbursed Amount 0
Franchise Name -
Lender Location ID 74899
Servicing Lender Name Washington Trust Bank
Servicing Lender Address 717 W Sprague Ave, SPOKANE, WA, 99201-3915
Rural or Urban Indicator U
Hubzone N
LMI N
Business Age Description Unanswered
Project Address BOISE, ADA, ID, 83709-3209
Project Congressional District ID-02
Number of Employees 13
NAICS code 333242
Borrower Race Unanswered
Borrower Ethnicity Unknown/NotStated
Business Type Corporation
Originating Lender ID 74899
Originating Lender Name Washington Trust Bank
Originating Lender Address SPOKANE, WA
Gender Male Owned
Veteran Non-Veteran
Forgiveness Amount 231260.27
Forgiveness Paid Date 2020-11-03

U.S. Small Business Administration Profile

Status User ID Name of Firm Trade Name UEI Address
Active P0298350 AMERICAN SEMICONDUCTOR, INC - C1BNR9HJBQK8 6987 W TARGEE ST, BOISE, ID, 83709-3209
Capabilities Statement Link -
Phone Number 208-336-2773
Fax Number 208-336-2752
E-mail Address lhackler@americansemi.com
WWW Page http://www.americansemi.com
E-Commerce Website http://www.americansemi.com
Contact Person LORELLI HACKLER
County Code (3 digit) 001
Congressional District 02
Metropolitan Statistical Area 1080
CAGE Code 1WGA8
Year Established 2001
Accepts Government Credit Card Yes
Legal Structure Corporation
Ownership and Self-Certifications -
Business Development Servicing Office BOISE DISTRICT OFFICE (SBA office code 1087)
Capabilities Narrative American Semiconductor serves the semiconductor and related industries as the leading developer and manufacturer of ultra-thin chip technology and manufacturing. The company invented and supplies Semiconductor-on-Polymer (SoP) wafer level chip scale packaging (WLCSP) for thin device applications that include, but are not limited to, chip-on-flex, protected fan-in, heterogeneous integration and multi-chip packaging. The company provides design, assembly, test and custom engineering services for thin-device technology. As an advanced packaging and assembly provider, American Semiconductor enables reliable high efficiency advanced packaging, assembly and test of thin electronics. Headquartered in Boise, Idaho, American Semiconductor operates a 9,000 square foot facility housing WLCSP fabrication, assembly and test operations.
Special Equipment/Materials (none given)
Business Type Percentages (none given)
Keywords Flexible Computer Chips, Flexible Hybrid Electronics, FleX, FHE, Thin Semiconductors, Advanced Packaging
Quality Assurance Standards (none given)
Electronic Data Interchange capable -

Current Principals
Name Douglas R Hackler Sr
Role CEO
Name Lorelli D Hackler
Role CFO

SBA Federal Certifications
HUBZone Certified No
Women Owned Certified No
Women Owned Pending No
Economically Disadvantaged Women Owned Certified No
Economically Disadvantaged Women Owned Pending No
Veteran-Owned Small Business Certified No
Veteran-Owned Small Business Joint Venture No
Service-Disabled Veteran-Owned Small Business Certified No
Service-Disabled Veteran-Owned Small Business Joint Venture No

Bonding Levels
Description Construction Bonding Level (per contract)
Level $0
Description Construction Bonding Level (aggregate)
Level $0
Description Service Bonding Level (per contract)
Level $0
Description Service Bonding Level (aggregate)
Level $0

NAICS Codes with Size Determinations by NAICS
Primary Yes
Code 334413
NAICS Code's Description Semiconductor and Related Device Manufacturing
Buy Green Yes
Code 334412
NAICS Code's Description Bare Printed Circuit Board Manufacturing
Buy Green Yes
Code 541330
NAICS Code's Description Engineering ServicesGeneral $22.50m Small Business Size Standard: [Yes]Special $41.50m Military and Aerospace Equipment and Military Weapons: [Yes]Special $41.50m Contracts and Subcontracts for Engineering Services Awarded Under the National Energy Policy Act of 1992: [Yes]Special $41.50m Marine Engineering and Naval Architecture: [Yes] (4)
Buy Green Yes
Code 541715
NAICS Code's Description Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology) General 1000 Employees Small Business Size Standard: [Yes]Special 1500 Employees Aircraft, Aircraft Engine and Engine Parts: [Yes]Special 1250 Employees Other Aircraft Parts and Auxiliary Equipment: [Yes]Special 1250 Employees Guided Missiles and Space Vehicles, Their Propulsion Units and Propulsion Parts: [Yes]
Buy Green Yes

Export Profile (Trade Mission Online)
Exporter Yes
Export Business Activities Manufacturer
Exporting to Australia; Austria; Finland; Germany; Italy; Netherlands
Desired Export Business Relationships Direct export sales
Description of Export Objective(s) Commercial Sale of Flexible Chips

Related by officers

Lorelli D Hackler

AMERICAN STRATEGIC INVESTMENTS, LLC

Douglas R Hackler

AMERICAN STRATEGIC INVESTMENTS, LLC GRACE ANGLICAN CHURCH OF BOISE, INCORPORATED

Related by address

No related companies by address

Date of last update: 07 Apr 2025

Sources: Idaho Secretary of State

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